The EMPIRE XPU simulator can be used to analyze planar, multilayer and surface circuits, components and antennas, multi-pin chip carriers, waveguides, as well as solve problems of signal integrity and electromagnetic compatibility, taking into account the external environment in which the device is located. To create a structure, a powerful graphics editor is included in the EMPIRE XPU package, which supports several formats for 3D structures importing and exporting. With this fastest computing core, the tasks of full-wave electromagnetic simulation, which previously took several days, can now be solved in minutes. Thanks to the unique adaptive “on-the-fly” code generating built into EMPIRE XPU, this package is by far the fastest of all known simulators. The operating principle is based on the Finite Difference Time Domain method (FDTD), that actually is the industrial standard for the design of RF and microwave components and antennas. The EMPIRE XPU software package is one of the leading solutions for modeling three-dimensional electromagnetic fields.
Comparison of individual Gerber layers or comparison of two separate PCB designs. Comparison of the topology with IPC-D-356 netlist format. Check for errors: absence of metallization in holes, minimum gaps, width of tracks or size of pads.Ĭalculating the copper layers fillability.Editing positive and negative apertures.This helps to localize errors in the topology and fix them faster. “Hot” communication with CAD from Cadence or Mentor Graphic: when selecting an element in them, we get its highlight in CAM350.Editing and adding any information on the board: pads, tracks, polygons, text, positioning signs, vias.Topology optimization: converting polygons and lines into raster objects, removing hole pads from unconnected layers, removing overlapping objects (pads under copper), editing / adding mask openings or windows in a solder mask layer, removing silk-screen printing overlapping pads.
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